Ivoclar Systemp.Onlay & Systemp.Inlay Universal Refills

FEATURES:

• • Good adhesion to tooth structure; no stickiness to instruments
  • Two degrees of elasticity
  • Fast curing and high curing depth
  • Low polymerization shrinkage
  • Minimal marginal gap formation and water absorption
  • Two shades; colour stability
  • Easy to remove in one piece
  • Antimicrobial agents and reduction of undesirable odours

  Description

  Systemp.inlay and Systemp.onlay are light-curing single-component materials for the fabrication of temporary restorations and do not require the additional use of a temporary cementation material.
  
  Systemp.inlay is particularly recommended for deep inlay preparations with parallel walls as well as for sealing implant screw access canals and for relining prefabricated crowns and bridges. Systemp.inlay is available in two shades, universal and transparent, and in two delivery forms (syringe and Cavifil).
  
  Systemp.onlay achieves a more rigid final cure than System.inlay because it features a higher content of inorganic fillers. The higher strength of Systemp.onlay provides advantages with regard to retention and occlusal and sagittal bracing. Therefore, the material is suited for large preparations.
  
  In addition, Systemp.onlay is suitable for long-term temporaries, flat preparations and preparations with strongly diverging walls. Systemp.onlay is available in two shades, universal and transparent, and in two delivery forms (syringe and Cavifil).

  COMPOSITION:

  Systemp.inlay

  The monomer matrix consists of high-molecular dimethacrylates. The fillers are highly dispersed silicon dioxide and copolymers. Triclosan, catalysts and stabilizers are additional ingredients.

  Systemp.onlay

  The monomer matrix consists of high-molecular dimethacrylates. The fillers are highly dispersed silicon dioxide and copolymers. Triclosan, catalysts and stabilizers are additional ingredients.

  INDICATION:

  • Systemp.inlay is especially suitable for deep inlay preparations with parallel walls. Systemp.inlay can also be used if small undercuts are present.
  • Systemp.inlay is also suitable for relining prefabricated, temporary crowns and bridges made of polycarbonate or methacrylates.
  • Systemp.inlay is also suitable for sealing implant screw access openings. –
  • Systemp.onlay is especially suitable for large preparations (onlays). If undercuts are present, please note that after curing, Systemp onlay is less elastic than Systemp.inlay, which may complicate removal

  Notes

  • Systemp.inlay/Systemp.onlay remains well in place in standard inlay preparations. If mechanical retention is minimal, the temporary restoration is cemented with a eugenol-free cement (e.g. Systemp®.link). If Systemp.inlay or Systemp.onlay is applied to undercuts of the proximal region, retention can be improved. In this case, do not place a matrix, but a wooden interdental wedge before applying Systemp.inlay/ Systemp.onlay.
  • Systemp.inlay/Systemp.onlay bonds with light-curing base/liner materials because of the similar chemical compositions. If such materials (light-curing glass ionomer cements, composites) are utilized, isolate the base with glycerine gel (Liquid Strip). This prevents the base/lining from being accidentally removed from the cavity together with Systemp.inlay/Systemp.onlay.
  • Use silicone finishers (Politip F) or tungsten carbide finishers for grinding and excess removal. Polish with silicone rubber polishers (Politip P). Excess material may also be removed with a scalpel.
  • To increase the stability of large cavities, a composite (e.g Heliomolar® or Tetric EvoCeram®) may be applied to the occlusal part of the temporary. Light- cure Systemp.inlay/ Systemp.onlay separately or together with the restorative material.
  • Systemp.inlay / Systemp.onlay can be contoured more easily by wetting the instrument with Systemp.desensitizer or an unfilled bonding agent (e.g. Heliobond).

  Key Specifications

  Storage temperature: 2 – 28 °C (36 – 82 °F)

  Technical Specification

  Standard - Composition	(in weight %)
  	Systemp.inlay	Systemp.onlay
  Polyester urethane dimethacrylate	49.4	29.4
  Ethyl triglycol methacrylate	---	7.5
  Highly dispersed silicon dioxide, silanized	16.4	19.4
  Copolymers	33	42.7
  Catalysts, stabilizers and triclosan	1.2	1
  Pigments	< 0.1	< 0.1

  Warning:

  Unpolymerized Systemp.inlay/Systemp.onlay should not come in contact with skin, mucous membrane, or eyes. Unpolymerized Systemp.inlay/Systemp.onlay may have a slight irritating effect and may lead to a sensitization against methacrylates. Commercial medical gloves do not provide protection against the sensitizing effect of methacrylates.

  Packaging

  • 3 x 2.5g Refills

  Direction to Use

  Preparation appointment

  Step 1: Prepare, place base or liner and take impression as usual.

  Step 2: Dry prepared teeth; use a matrix if necessary.

   

  Step 3: Clean cavity with water spray

  Step 4: Application of Systemp.desensitizer: Apply Systemp.desensitizer and brush the material gently into the dentin for 10 seconds

   

  Step 5: Carefully dry with blown air

  Step 6: Place a sufficient quantity of Systemp.inlay or Systemp.onlay into the cavity, using a spatula or another suitable instrument. If you use Cavifils, the material can be applied directly into the cavity by means of the Cavifil Injector. Contour the restoration, leaving minimum excess.

   

  Step 7: Increments of up to 4 mm can be cured with a standard curing light (e.g. bluephase® C5) in 10 seconds, if the light intensity is higher than 500 mW/cm2. The same depth of cure is achieved with LED lights that produce a higher light intensity (e.g. bluephase®) after an exposure time of 10 seconds in the low power mode (LOP).

  Step 8: Remove matrix

   

  Step 9: Check occlusion.

  Insertion appointment

  Step 1: Insert a suitable instrument (e.g. probe/scaler) into the temporary restoration. Remove Systemp.inlay or Systemp.onlay from the cavity

  Step 2: Subsequently, clean the cavity (e.g. with rubber cups and cleaning paste).

  Step 3: Try in and seat the restoration.